SILVER SOLDER 15%
TTD 58.23
- .050" x 1/8" x 20"
- 15% Silver, 6% Phosphorus, remainder Copper
- Similar to 15% silphos with the ability to fill gaps and form fillets without adversely affecting strength
- Phosphorus acts as a fluxing agent when joining copper to copper.
- Solidus Temperature: 1190°F, 643°C
- Liquidus Temperature: 1495°F, 813°C
- Recommended Brazing Range: 1325-1500°F, 720-815°C
- Meets AWS BCuP-3
SILVER SOLDER 0%
TTD 25.00
- .050" x 1/8" x 20"
- 0% Silver, 6% Phosphorus, remainder Copper
- Similar to 15% silphos with the ability to fill gaps and form fillets without adversely affecting strength
- Phosphorus acts as a fluxing agent when joining copper to copper.
- Solidus Temperature: 1190°F, 643°C
- Liquidus Temperature: 1495°F, 813°C
- Recommended Brazing Range: 1325-1500°F, 720-815°C
- Meets AWS BCuP-3
SILVER SOLDER 5%
TTD 25.00
- .050" x 1/8" x 20"
- 5% Silver, 6% Phosphorus, remainder Copper
- Similar to 15% silphos with the ability to fill gaps and form fillets without adversely affecting strength
- Phosphorus acts as a fluxing agent when joining copper to copper.
- Solidus Temperature: 1190°F, 643°C
- Liquidus Temperature: 1495°F, 813°C
- Recommended Brazing Range: 1325-1500°F, 720-815°C
- Meets AWS BCuP-3