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  • ACM74918902 LG Controller Assembly
    TTD 2,633.91

    LG Logo

    LG Controller Assembly
    Part#: ACM74918902
    Packaged Dimensions: 10 1/4" x 6 3/4” x 2 3/4”
    Packaged Weight: 0.78 lb

  • ACM75098802 LG Controller Assembly
    TTD 3,059.93

    LG Logo

    LG Controller Assembly
    Part#: ACM75098802
    Packaged Dimensions: 10 3/4" x 6 3/4” x 2 3/4”
    Packaged Weight: 0.9 lb

  • Silver Solder 56% With Orange Flux Coating
    TTD 90.00
    • .050" x 1/8" x 20"
    • 56% Silver, 6% Phosphorus, remainder Copper
    • Similar to 15% silphos with the ability to fill gaps and form fillets without adversely affecting strength
    • Phosphorus acts as a fluxing agent when joining copper to copper.
    • Solidus Temperature: 1190°F, 643°C
    • Liquidus Temperature: 1495°F, 813°C
    • Recommended Brazing Range: 1325-1500°F, 720-815°C
    • Meets AWS BCuP-3
  • Silver Solder 45% With Blue Flux Coating
    TTD 84.38
    • .050" x 1/8" x 20"
    • 45% Silver, 6% Phosphorus, remainder Copper
    • Similar to 15% silphos with the ability to fill gaps and form fillets without adversely affecting strength
    • Phosphorus acts as a fluxing agent when joining copper to copper.
    • Solidus Temperature: 1190°F, 643°C
    • Liquidus Temperature: 1495°F, 813°C
    • Recommended Brazing Range: 1325-1500°F, 720-815°C
    • Meets AWS BCuP-3
  • Silver Solder 15%
    TTD 45.00
    • .050" x 1/8" x 20"
    • 15% Silver, 6% Phosphorus, remainder Copper
    • Similar to 15% silphos with the ability to fill gaps and form fillets without adversely affecting strength
    • Phosphorus acts as a fluxing agent when joining copper to copper.
    • Solidus Temperature: 1190°F, 643°C
    • Liquidus Temperature: 1495°F, 813°C
    • Recommended Brazing Range: 1325-1500°F, 720-815°C
    • Meets AWS BCuP-3
  • Silver Solder 0%
    TTD 5.63
    • .050" x 1/8" x 20"
    • 0% Silver, 6% Phosphorus, remainder Copper
    • Similar to 15% silphos with the ability to fill gaps and form fillets without adversely affecting strength
    • Phosphorus acts as a fluxing agent when joining copper to copper.
    • Solidus Temperature: 1190°F, 643°C
    • Liquidus Temperature: 1495°F, 813°C
    • Recommended Brazing Range: 1325-1500°F, 720-815°C
    • Meets AWS BCuP-3
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