Silver Solder 0%

TTD 6.40
In stock
  • .050" x 1/8" x 20"
  • 0% Silver, 6% Phosphorus, remainder Copper
  • Similar to 15% silphos with the ability to fill gaps and form fillets without adversely affecting strength
  • Phosphorus acts as a fluxing agent when joining copper to copper.
  • Solidus Temperature: 1190°F, 643°C
  • Liquidus Temperature: 1495°F, 813°C
  • Recommended Brazing Range: 1325-1500°F, 720-815°C
  • Meets AWS BCuP-3
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